Huawei Kunpeng 930 Teardown Confirms TSMC 5nm Process & 120-Core Design

Huawei Kunpeng 930 Teardown Confirms TSMC 5nm Process and Powerful New Architecture

A new teardown has finally revealed the true power behind Huawei’s latest data center processor — the Kunpeng 930 chip. Contrary to earlier speculation suggesting Huawei was relying on outdated technology, the teardown confirms that the Kunpeng 930 is built on TSMC’s advanced 5nm process, showcasing a leap forward in performance and efficiency.

Key Details From the Kunpeng 930 Teardown

Well-known tipster @Kurnalsalts shared insights after dismantling the Kunpeng 930, exposing details about its chip packaging, memory configuration, and I/O architecture.

Massive Chip Size

The Kunpeng 930 measures 77.5mm x 58.0mm, making it 81.26% larger in IOD area than its predecessor.

Memory & Connectivity

It supports 96 PCIe lanes alongside 16-channel DDR5 memory, enabling high-speed data handling for enterprise-grade workloads.

Multi-Socket Design

Built on a dual-socket motherboard, it allows dual CPU functionality, boosting scalability for data-intensive tasks.

Chiplet Layout

The processor includes four compute chiplets (252.3mm² each) and one large IO die (312.3mm²).

CPU Cluster & Core Specifications

At the heart of the Kunpeng 930 lies a Mount Taishan-based CPU architecture. Each die houses 10 CPU clusters with 4 cores per cluster, meaning one die holds 40 cores. With multiple dies combined, the Kunpeng 930 packs an impressive 120 cores, accompanied by 91MB of L3 cache and 2MB of L2 cache, ensuring lightning-fast performance.

Performance Over Its Predecessor

Compared to its predecessor, the Kunpeng 930 doubles the core count and delivers a substantial upgrade in cache memory. Thanks to the TSMC 5nm process, Huawei also benefits from enhanced SRAM density, improving efficiency and overall throughput for data center applications.